In Line Phased Array Inspection of Encapsulated Battery Structural Adhesives
Inline phased array testing maps structural adhesive wet-out and void formation through metal pack enclosures in real time at production line speeds.
C-Scan Mapping
Meaning
Quality control workflows in electrochemical manufacturing employ two-dimensional ultrasonic acoustic imaging to inspect internal solid interfaces without destroying sample components. Conducting c-scan mapping provides spatial planar cross-sections showing acoustic impedance mismatches within pouch cells, solid-state electrolytes, and tab welds. Transducers raster across cell surfaces to record echo amplitude and time-of-flight data at specified depth gates.
Ultrasonic attenuation analysis reveals hidden micro-cracks before electrical cycling commences. This inspection technique applies exclusively to non-destructive planar defect detection in laminated or solid-state cell structures.
Acoustic Reflection
Piezoelectric transducers emit high-frequency acoustic waves that propagate through cell layers and reflect at structural interfaces. Boundary layer discontinuities cause acoustic energy to scatter when internal delamination occurs. Echo signals return to the receiver with phase shifts indicating localized density variations.
Signal processing algorithms convert voltage amplitudes into colour-coded planar raster maps.
Defect Resolution
Transducer frequency determines minimum detectable flaw sizes within multi-layer cell geometries. High-frequency probes resolve sub-millimetre gas pockets while lower frequencies penetrate deeper composite layers. Spatial sampling intervals must match focus spot sizes to prevent spatial aliasing during scan acquisition.
Inspection Throughput
Automated immersion arrays scan commercial pouch cells in line during mass production. Quantitative defect thresholds trigger automated part rejection when delamination areas exceed specified tolerances.
Ultrasonic Phase Inversion Mapping for Cell Bond Evaluation
Acoustic phase inversion mapping detects cell bond voiding by identifying the 180 degree pulse polarity shift caused by metal to gas impedance drops.