Meaning
Mechanical degradation characterised by the loss of spring force in spring-loaded electrical contact probes over repeated cycles threatens the contact resistance stability of battery test fixtures. This process, termed pogo pin relaxation, occurs because of continuous mechanical and thermal cycling during automated cell testing. As the internal spring wears down, it exerts less force on the terminal of the cell under test.
This loss of force leads to a significant increase in contact resistance, which can skew the measurement of cell voltage and internal resistance.
Contact Resistance
High contact resistance caused by pogo pin relaxation introduces artificial voltage drops that can prematurely trigger the voltage cut-offs of the test equipment. This issue causes test runs to abort or report falsely low capacities for the cells being evaluated. Maintenance routines must include periodic measurements of the contact force to identify worn pins before they disrupt testing schedules.
Swapping these pins on a schedule prevents costly downtime.
Thermal Cycle
High currents flowing through loose contacts generate localized heat, which accelerates the mechanical wear of the internal springs. This heating creates a feedback loop that rapidly destroys the contact pin.
Quality Control
Implementing regular calibration cycles for test fixtures helps to identify degraded contacts before they affect product quality. Automated systems can monitor the voltage drop across the pins during testing to alert technicians to impending failures.